Key Developments For Amkor Technology, Inc.

Amkor Technology, Inc. (AMKR.O) (Nasdaq)
As of  1 Dec 2009
5.74USD
Price Change
+0.19
Percent Change
+3.42%
 
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ITC Reaffirms Ruling That Carsem Infringes Amkor Technology, Inc. MLF Patent
Monday, 2 Nov 2009 09:00am EST 

Amkor Technology, Inc. announced that the Administrative Law Judge (ALJ) in Amkor's patent infringement case against Carsem in the International Trade Commission (ITC) has reaffirmed his prior ruling that the Carsem Dual and Quad Flat No-Lead Packages infringe some of Amkor`s patent claims relating to MicroLeadFrame (MLF) technology, that all of Amkor's asserted patent claims are valid, and that Carsem violated Section 337 of the Tariff Act. 

 
Amkor Technology, Inc. Issues Q4 2009 Guidance Above Analysts' Estimates
Tuesday, 27 Oct 2009 04:07pm EDT 

Amkor Technology, Inc. announced that for the fourth quarter of 2009, it expects net sales to be flat, plus or minus 2%, from the third quarter of 2009 and expects net income to be in the range of $0.17 to $0.23 per diluted share (EPS). The Company reported revenues of $ $616 million for the third quarter of 2009. According to Reuters Estimates, analysts are expecting the Company to report EPS of $0.16 on revenues of $586.9 million for fourth quarter of 2009. 

 
Nakaya Microdevices Corporation, Amkor Technology, Inc. And Toshiba Corporation Sign Definitive Agreements On Joint Venture For Semiconductor Assembly And Test Service
Monday, 26 Oct 2009 03:28am EDT 

Nakaya Microdevices Corporation (NMD), Amkor Technology, Inc. and Toshiba Corporation, announced that they have signed definitive agreements for the formation of a joint venture to provide semiconductor assembly and final testing services in Japan. NMD, Amkor and Toshiba entered into discussions regarding a possible joint venture at the start of this year, and October 26, 2009, announcement follows an April 28, 2009 memorandum of understanding between the parties. The new company is expected to begin operations on October 31. Under the terms of the definitive agreements, NMD will become a joint venture, 60% owned by the existing shareholders of NMD, 30% by Amkor and 10% by Toshiba, and it will change its name to J-Devices Corporation (J-Devices). Under the definitive agreements, the following equipment and operations will be transferred to J-Devices: the back-end process business, including technology development, at Toshiba LSI Package Solutions Corporation (TPACS), a Japan-based semiconductor packaging company wholly owned by Toshiba; the system LSI and memory back-end process equipment at TPACS' Oita Works and Fukuoka Works; and certain wafer probing equipment installed at Toshiba's Oita Operations. TPACS' employees working for the transferred business will engage in the same business at J-Devices. 

 
Nakaya Microdevices Corporation, Amkor Technology, Inc. And Toshiba Corporation Sign Definitive Agreements On Joint Venture For Semiconductor Assembly And Test Services
Friday, 23 Oct 2009 05:30am EDT 

Nakaya Microdevices Corporation (NMD), Amkor Technology, Inc. and Toshiba Corporation announced that they have signed definitive agreements for the formation of a joint venture to provide semiconductor assembly and final testing services in Japan. NMD, Amkor and Toshiba entered into discussions regarding a possible joint venture at the start of this year, and October 23, 2009, announcement follows an April 28, 2009, memorandum of understanding between the parties. The new company is expected to begin operations on October 31. Under the terms of the agreements, NMD will become a joint venture, 60% owned by the existing shareholders of NMD, 30% by Amkor and 10% by Toshiba, and it will change its name to J-Devices Corporation. Under the definitive agreements, the following equipment and operations will be transferred to J-Devices: the back-end process business, including technology development, at Toshiba LSI Package Solutions Corporation (TPACS), a semiconductor packaging company wholly owned by Toshiba; the system LSI and memory back-end process equipment at TPACS` Oita Works and Fukuoka Works; and certain wafer probing equipment installed at Toshiba's Oita Operations. TPACS` employees working for the transferred business will engage in the same business at J-Devices. 

 
Amkor Technology, Inc. Announces Senior Management Changes
Thursday, 1 Oct 2009 05:04pm EDT 

Amkor Technology, Inc. announced that pursuant to the succession plan approved by the Board on June 25, 2009, James Kim, the Company's Founder and former Chief Executive Officer, has become Executive Chairman of the Board of Directors and Ken Joyce has assumed the position of Chief Executive Officer and President of the Company. Mr. Joyce has also joined the Company's Board of Directors. 

 
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