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Advanced Semiconductor Engineering Inc (2311.TW)

2311.TW on Taiwan Stock Exchange

37.95TWD
28 Apr 2017
Change (% chg)

NT$0.05 (+0.13%)
Prev Close
NT$37.90
Open
NT$37.65
Day's High
NT$38.00
Day's Low
NT$37.50
Volume
16,043
Avg. Vol
14,762,577
52-wk High
NT$39.90
52-wk Low
NT$27.99

2311.TW

Chart for 2311.TW

About

Advanced Semiconductor Engineering, Inc. is a provider of semiconductor packaging and testing services. The Company offers a range of semiconductors packaging, testing and electronic manufacturing services (EMS). The Company's segments include Packaging, Testing, EMS and Others. The Company provides services in packaging bare... (more)

Overall

Beta: 1.52
Market Cap(Mil.): NT$313,981.09
Shares Outstanding(Mil.): 8,273.55
Dividend: 1.40
Yield (%): 4.19

Financials

  2311.TW Industry Sector
P/E (TTM): 16.05 28.14 20.94
EPS (TTM): 2.36 -- --
ROI: 9.67 1.60 10.87
ROE: 13.81 -28.09 10.88

BRIEF-Advanced Semiconductor Engineering announces monthly net revenues

* Announces monthly net revenues Source text for Eikon: Further company coverage:

Apr 10 2017

BRIEF-Taiwan's ASE posts 3.3 pct fall in March

Further company coverage: ($1 = 30.6260 Taiwan dollars) (Reporting by Hong Kong newsroom)

Apr 10 2017

BRIEF-Advanced Semiconductor Engineering to pay cash dividends of T$ 1.4 per share for 2016

March 30 Advanced Semiconductor Engineering Inc :

Mar 30 2017

BRIEF-HANMI Semiconductor signs contract worth 2.07 bln won

* Says it signed a 2.07 billion won contract with ASE Group(Advanced Semiconductor Engineering, Inc) to provide semiconductor manufacturing equipment

Mar 20 2017

BRIEF-Taiwan's ASE posts 19.5 pct rise in Feb consolidated sales

Further company coverage: ($1 = 30.8800 Taiwan dollars) (Reporting by Hong Kong newsroom)

Mar 07 2017

BRIEF-Xped says it signed MOU with Advanced Semiconductor Engineering (Taiwan)

* signed mou with Advanced Semiconductor Engineering (Taiwan) for licensing of XPED ADRC technologies Source text:(http://bit.ly/2lKjDOP) Further company coverage:

Feb 26 2017

BRIEF-Hanmi Semiconductor signs contract worth 4.51 bln won

* Says it signed a 4.51 billion won contract with ASE Group(Advanced Semiconductor Engineering, Inc) to provide semiconductor manufacturing equipment in Taiwan

Feb 13 2017

BRIEF-Taiwan's ASE posts 7.1 pct rise in Jan sales

Further company coverage: ($1 = 31.1100 Taiwan dollars) (Reporting by Hong Kong newsroom)

Feb 08 2017

BRIEF-ACE to issue new shares for loan repayment

* Says it will issue 300 million new shares at T$34.3/share with subscription record date Feb. 15

Feb 02 2017

BRIEF-Taiwan's ASE orders equipment for T$500.4 mln

* Says it orders equipment for T$500.4 million ($16.09 million) from Towa Corporation

Feb 02 2017

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