Semiconductor Equipment & Testing

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STATS ChipPAC Ltd announces dissolution of subsidiary

Thursday, 26 Dec 2013 08:23am EST

STATS ChipPAC Ltd:Says its wholly-owned subsidiary, STATS ChipPAC Semiconductor Shanghai Co., Ltd. (incorporated in China), which was placed under voluntary liquidation, has been dissolved.

Top Engineering Co., Ltd. to merge with subsidiary

Friday, 20 Dec 2013 03:27am EST

Top Engineering Co., Ltd:Says to merge with a wholly owned subsidiary, a Korea-based company engaged in the manufacturing and distribution of displayer and semiconductor tester.Says merger effective date of Mar. 5, 2014.

STATS ChipPAC Ltd updates on dissolution of subsidiary

Monday, 16 Dec 2013 07:43am EST

STATS ChipPAC Ltd:Says refers to the announcement dated Oct. 14.Its wholly owned subsidiary, ChipPAC Luxembourg S.a.r.l (incorporated in Luxembourg), which has been placed under voluntary liquidation, has been dissolved.

Gongin Precision Industrial Co Ltd to merge with subsidiary

Tuesday, 10 Dec 2013 03:47am EST

Gongin Precision Industrial Co Ltd:Says it plans to merge with a wholly owned subsidiary on Jan. 11, 2014.Says the subsidiary will be dissolved after the merger.

STATS ChipPAC Ltd Announces Dissolution Of Subsidiary

Wednesday, 30 Oct 2013 06:01am EDT

STATS ChipPAC Ltd announced that its wholly-owned subsidiary, STATS Holdings Limited (incorporated in British Virgin Islands), which has been placed under voluntary liquidation, has been dissolved.

STATS ChipPAC Ltd Announces Voluntary Liquidation Of Subsidiaries

Sunday, 13 Oct 2013 06:51pm EDT

STATS ChipPAC Ltd announced the following subsidiaries of the Company will be placed under voluntary liquidation on October 14, 2013: STATS Holdings Limited (incorporated in British Virgin Islands); ChipPAC Luxembourg S.a.r.l (incorporated in Luxembourg) and ChipPAC Liquidity Management Hungary Limited Liability Company (incorporated in Hungary). The voluntary liquidation of the above mentioned subsidiaries is not expected to have any material impact on the consolidated net tangible assets or earnings per share of the Company for the financial year ending December 29, 2013.

TESEC Corp Announces Result of Early-retirement Program; Expects Extraordinary Loss for Q2 of FY 2014

Tuesday, 24 Sep 2013 04:00am EDT

TESEC Corp announced that 31 employees have taken up the offer of an early-retirement program. The retirement date is September 30, 2013. The Company expects JPY 155 million extraordinary loss on the retirement payment for the second quarter of the fiscal year ending March 2014.

STATS ChipPAC Ltd Announces Voluntary Liquidation Of Subsidiary

Tuesday, 17 Sep 2013 06:14am EDT

STATS ChipPAC Ltd announced that STATS ChipPAC Semiconductor Shanghai Co., Ltd. (“STATS ChipPAC Semiconductor Shanghai”), an inactive wholly-owned subsidiary of the Company incorporated in China has been placed under voluntary liquidation.

Seiwa Electric Mfg Co Ltd to Merge with Wholly Owned Subsidiary

Wednesday, 11 Sep 2013 03:00am EDT

Seiwa Electric Mfg Co Ltd announced that it has decided to merge with a wholly owned subsidiary, which is engaged in human labor outsource business and contract business for manufacturing companies, based in Kyoto, effective November 1, 2013. After this, the Company will be the surviving company and the subsidiary will be dissolved.

JAPAN ELECTRONIC MATERIALS CORP to Dissolve Subsidiary; Announces Waiver of Debt

Tuesday, 3 Sep 2013 12:00am EDT

JAPAN ELECTRONIC MATERIALS CORP announced that it has decided to dissolve a 60%-owned subsidiary, JEM FINE TEC CORP. Due to this development, the Company is expecting to waive the obligations of JPY 495 million of the subsidiary.

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