March 23, 2018 / 11:03 AM / in a month

BRIEF-ASE's Unit Universal Scientific Industrial Shanghai To Issue Up To 2.7 Bln Yuan Bonds

Reuters Staff

1 Min Read

March 23 (Reuters) - Advanced Semiconductor Engineering Inc :

* SAYS UNIT UNIVERSAL SCIENTIFIC INDUSTRIAL SHANGHAI PLANS TO ISSUE UP TO 2.7 BILLION YUAN ($427.18 million)BONDS Source text for Eikon: Further company coverage: ($1 = 6.3205 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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