March 7, 2018 / 1:14 AM / 9 months ago

BRIEF-China Shandong Hi-Speed Financial Announces ‍Issue Of Additional $200 Mln Bonds Due 2019​

March 7 (Reuters) - China Shandong Hi-Speed Financial Group Ltd:

* ANNOUNCES ‍ISSUE OF ADDITIONAL US$200 MILLION 3.9% GUARANTEED BONDS DUE 2019​ Source text for Eikon: Further company coverage:

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