November 23, 2017 / 10:38 AM / a month ago

BRIEF-HeiTech Padu Bhd accepted letter of award for 33.3 million RGT‍​

Nov 23 (Reuters) - HeiTech Padu Bhd:

* Accepted letter of award for supply of security infrastructure for Companies Commision Of Malaysia for 33.3 million RGT‍​

* Letter of award to contribute positively to future earnings of co‍​ Source text: (bit.ly/2jQDayx) Further company coverage:

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