Reuters logo
BRIEF-Radium Life Tech to issue 2017 2nd tranche corporate bonds worth T$500 mln
November 13, 2017 / 11:22 AM / 12 days ago

BRIEF-Radium Life Tech to issue 2017 2nd tranche corporate bonds worth T$500 mln

Nov 13 (Reuters) - Radium Life Tech Co Ltd :

* Says it plans to issue 2017 2nd tranche 5-year secured corporate bonds worth T$500 million with coupon rate of 1.02 percent

Source text in Chinese: goo.gl/txaQ8r

Further company coverage: (Beijing Headline News)

Our Standards:The Thomson Reuters Trust Principles.
0 : 0
  • narrow-browser-and-phone
  • medium-browser-and-portrait-tablet
  • landscape-tablet
  • medium-wide-browser
  • wide-browser-and-larger
  • medium-browser-and-landscape-tablet
  • medium-wide-browser-and-larger
  • above-phone
  • portrait-tablet-and-above
  • above-portrait-tablet
  • landscape-tablet-and-above
  • landscape-tablet-and-medium-wide-browser
  • portrait-tablet-and-below
  • landscape-tablet-and-below