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Winbond Electronics Corp.

2344.TW

Latest Trade

19.20TWD

Change

0.15(+0.79%)

Volume

12,207,454

Today's Range

19.05

 - 

19.25

52 Week Range

13.55

 - 

20.60

As of on the Taiwan Stock Exchange ∙ Minimum 15 minute delay

Pricing

Previous Close
19.05
Open
19.20
Volume
12,207,454
3M AVG Volume
666.64
Today's High
19.25
Today's Low
19.05
52 Week High
20.60
52 Week Low
13.55
Shares Out (MIL)
3,980.00
Market Cap (MIL)
76,416.00
Forward P/E
--
Dividend (Yield %)
5.21

Latest Developments

More

Winbond Electronics says 2017 dividend payment date is Sep. 7

Winbond Electronics to issue corporate bonds worth up to T$10 bln

Nuvoton Technology says dissolution and liquidation of unit Pigeon Creek Holding

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About Winbond Electronics Corp.

WINBOND ELECTRONICS CORP. is a Taiwan-based company principally engaged in the research, development, design, manufacture and sales of integrated circuits (ICs) and memory products. The Company’s products mainly include logic ICs, dynamic random access memory (DRAM) products, including mobile RAM products, specialty DRAM products and graphics DRAM products, as well as flash memory products and others. The Company’s products are primarily applied in computers, communications and consumer electronics (3Cs), such as personal computers, wireless networks, set-top boxes, televisions, digital cameras and others. The Company distributes its products both in domestic markets and to overseas markets.

Contact Info

No.8

Keya 1st Rd, Cntrl Science Industrl Prk

Daya District

+886.42.5218168

http://www.winbond.com

Executive Leadership

Yu-Cheng Chiao

Chairman of the Board, Chief Executive Officer

Yuan-Mow Su

Vice Chairman of the Board, Deputy Chief Executive Officer

Yung Chin

Chief Administrative Officer, Director

Tung-Yi Chan

General Manager

Chiou-Jii Huang

Deputy General Manager, Head of Finance & Accounting

Key Stats

2.25 mean rating - 4 analysts
Sell
Hold
Buy
Revenue (MM, TWD)

2016

42.1K

2017

47.6K

2018

51.2K

2019(E)

49.0K
EPS (TWD)

2016

0.797

2017

1.540

2018

1.870

2019(E)

0.490
Price To Earnings (TTM)
32.61
Price To Sales (TTM)
1.59
Price To Book (MRQ)
1.28
Price To Cash Flow (TTM)
6.90
Total Debt To Equity (MRQ)
45.81
LT Debt To Equity (MRQ)
34.36
Return on Investment (TTM)
3.13
Return on Equity (TTM)
2.57

Latest News

Latest News

BRIEF-Winbond Electronics to issue corporate bonds worth up to T$10 bln

* Says it plans to issue corporate bonds worth up to T$10 billion, with a term of 7 years and interest rate of no more than 1.3 percent

BRIEF-Winbond Electronics to pay cash dividends of T$1 per share for 2017

* Says it will use undistributed profit to pay cash dividends of T$1 per share to shareholders for 2017

BRIEF-Winbond Electronics to invest T$1.54 bln to buy facilities and build new office building

* Says it plans to invest T$1.54 billion to buy R&D facilities and build new office building

BRIEF-Winbond Electronics sets issue price at T$22 for new share issuance

* Says it plans to issue about 400 million new shares of its common stock

BRIEF-Winbond Electronics buys machinery equipments for T$2.61 bln

* Says it acquired a batch of machinery equipments for production from Applied Materials South EastAsia pte. Ltd, at a price of T$2.61 billion

BRIEF-Winbond Electronics plans new issuance for production expansion

* Says it plans to issue about 400 million new shares of its common stock

BRIEF-Rambus signs patent license agreement with Winbond

* Rambus inc - agreement covers use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021 Source text for Eikon: Further company coverage:

Quote and financial data from Refinitiv. Fund performance data provided by Lipper. All quotes delayed a minimum of 15 minutes.

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