Profile: Cabot Microelectronics Corp (CCMP.O)
24 May 2019
Cabot Microelectronics Corporation, incorporated on October 6, 1999, supplies polishing slurries and pads used in the manufacture of integrated circuit (IC) devices within the semiconductor industry, in a process called chemical mechanical planarization (CMP). The Company is engaged in the development, manufacture and sale of CMP consumables. The Company develops, produces and sells CMP slurries for polishing conducting and insulating materials used in IC devices, and also for polishing the disk substrates and magnetic heads used in hard disk drives. It also develops, manufactures and sells CMP polishing pads, which are used in conjunction with slurries in the CMP process. The Company also pursues other surface modification applications through its engineered surface finishes (ESF) business.
The Company offers CMP polishing pads, under the Epic and NexPlanar brand names, for a range of applications and technology nodes. Its CMP slurries include copper-barrier-aluminum, data storage, dielectrics, emerging applications, silicon carbide wafer, silicon wafer, through-silicon via (TSV) and tungsten. Its platform of slurries includes front side slurries for copper, barrier and nitride CMP and backside slurries for silicon, oxide and polymer CMP. It provides equipment and services for precision finishing and fabrication for a range of industries through its engineered surface finishes business.
Cabot Microelectronics Corp
870 N Commons Dr
AURORA IL 60504-7963