Profile: Kulicke and Soffa Industries Inc (KLIC.OQ)
Kulicke and Soffa Industries, Inc., incorporated on November 26, 1956, designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs) and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.
The Company manufactures and sells ball bonders that are used to connect fine wires, typically made of gold or copper, between the bond pads of the semiconductor device, or die, and the leads on its package. Wafer level bonders mechanically apply bumps to die, typically while still in the wafer format, for some variants of the flip chip assembly process. Wedge bonders use either aluminum wire or ribbon to perform the same function in packages that cannot use gold or copper wire because of either high electrical current requirements or other package reliability issues. Its products include IConn PLUS series, IConn ProCu PLUS series, IConn MEM PLUS series, ConnX PLUS series, ConnX LED PLUS, AT Premier PLUS, 3600 PLUS, 3700 PLUS, 7200 PLUS, 7200HD, PowerFusion TL, PowerFusion HL, Asterion, APAMA C2S (APLR), APAMA C2W (APLR), Hybrid Series (APMR), iX Series (SMT) and iFlex Series (SMT), among others.
The Company's main product platform for ball bonding is the Power Series, which is a family of assembly equipment. The Company manufactures wedge bonders for the power semiconductor and automotive power module markets. Its Advanced Packaging with Adaptive Machine Analytics (APAMA) chip-to-substrate (C2S) bonder is designed for flip chip, thermo-compression bonding (TCB) applications. The Company also offers spare parts, equipment repair, maintenance and servicing, training services, and upgrades for its equipment through its Support Services business unit. Its K&S Care service is designed to help customers operate their machines. K&S Care includes a range of programs, offering different levels of service depending on customer needs.
Expendable Tools Segment
The Company manufactures and sells capillaries, quantis, teracap, dicing blades and bonding wedges. Capillaries are expendable tools used in ball bonders. Dicing blades are expendable tools used by semiconductor manufacturers to cut silicon wafers into individual semiconductor die or to cut packaged semiconductor units into individual units. Bonding wedges are expendable tools used in wedge bonders. Wedge tools are used for both wire and ribbon applications.
Kulicke and Soffa Industries Inc
23A Serangoon North Avenue 5
#01-01 K&S Corporate Headquarter
FORT WASHINGTON 554369