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Profile: Micron Technology Inc (MU.O)

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Micron Technology, Inc., incorporated on April 6, 1984, is engaged in semiconductor systems. The Company's portfolio of memory technologies, including dynamic random-access memory (DRAM), negative-AND (NAND) Flash and NOR Flash are the basis for solid-state drives, modules, multi-chip packages and other system solutions. Its business segments include Compute and Networking Business Unit (CNBU), which includes memory products sold into compute, networking, graphics and cloud server markets; Mobile Business Unit (MBU), which includes memory products sold into smartphone, tablet and other mobile-device markets; Storage Business Unit (SBU), which includes memory products sold into enterprise, client, cloud and removable storage markets, and SBU also includes products sold to Intel through its Intel/Micron Flash Technology (IMFT) joint venture, and Embedded Business Unit (EBU), which includes memory products sold into automotive, industrial, connected home and consumer electronics markets. The Company's memory solutions enable computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. The Company markets its products through internal sales force, independent sales representatives and distributors primarily to original equipment manufacturers (OEMs) and retailers located around the world.

The Company's Double Data Rate type three (DDR3) DRAM products are focused at computers, servers, networking devices, communications equipment, consumer electronics, automotive and industrial applications. It offers DDR3 products in over one gigabit (Gb), two Gb, four Gb and eight Gb densities. It also offers Double Data Rate type four (DDR4) DRAM products in over four Gb and eight Gb densities. Its Mobile Low-Power DRAM (LPDRAM) products are used in mobile phones, tablets, embedded applications, ultra-thin laptop computers and other mobile consumer devices. It offers DDR4, DDR3, Double Data Rate type two (DDR2) and Double Data Rate (DDR) versions of LPDRAM. The Company also offers other DRAM products to markets, including DDR2 DRAM, DDR DRAM, graphics double data rate, version 5 (GDDR5), synchronous dynamic random access memory (SDRAM), reduced-latency dynamic random access memory (RLDRAM) and pseudo static random-access memory (PSRAM). It offers hybrid memory cube (HMC) products, which are focused at networking and computing applications.

The Company's non-volatile memory products include NAND Flash and 3D XPoint memory. The embedded NAND Flash-based storage devices are utilized in mobile phones, solid state drives (SSDs), tablets, computers, industrial and automotive applications, networking, and other personal and consumer applications. The removable storage devices, such as universal serial bus (USB) and flash memory cards are used with applications, such as personal computers (PCs), digital still cameras and mobile phones. Its NAND Flash products feature a small cell structure that enables higher densities. It offers single-level cell (SLC), multi-level cell (MLC) and triple-level cell (TLC) NAND Flash products. MLC and TLC products have two and three times, respectively, the bit density of SLC products. The Company offers client and enterprise SSDs. Its client SSDs are focused at notebooks, desktops, workstations and other consumer applications. Using its NAND Flash process technology and a Serial Advanced Technology Attachment (SATA) six Gb per second interface, its SSDs deliver read and write speeds. Its client SSDs feature encryption for corporate users and are offered in a 2.5-inch, M.2., and mSATA modules, with densities of approximately one terabyte. It offers enterprise SSDs with both peripheral component interconnect express (PCIe) and SATA interfaces with capacities of over 1.4 terabytes.

The Company also offers managed multi-chip package (MCP) products, which incorporate its NAND Flash. The managed NAND Flash products include e-MMC, e-MCP and embedded USB. Its e-MMC products combine NAND Flash with a logic controller that performs media management and error code correction (ECC). Through its Lexar brand, the Company sells digital media products and other flash-based storage products through retail and OEM channels. Its digital media products include a range of flash memory cards and JumpDrive products with a range of speeds, capacities and value-added features. The Company offers flash memory cards in a range of speeds and capacities and in all media formats, including CompactFlash, Memory Stick and Secure Digital (SD) formats. Its other products include SD memory cards and some JumpDrive products, which incorporate third party controllers. The Company also manufactures products that are sold under other brand names and resells flash memory products that are purchased from other NAND Flash suppliers. Its other products include primarily NOR Flash, which are electrically re-writeable, semiconductor memory devices and are used in wireless and embedded applications.

The Company uses its AMBYX line of test and burn-in systems to perform simultaneous circuit tests of semiconductor memory die during the burn-in process. The Company's manufacturing facilities are located in the United States, China, Japan, Malaysia, Singapore and Taiwan. Its products are manufactured on approximately 300 millimeters (mm) wafers in facilities. It sells semiconductor products in both packaged and unpackaged forms. The Company offers its semiconductor memory products under the Micron, Lexar, Crucial, SpecTek and Elpida brand names and private labels. It sells Lexar-branded NAND Flash memory products through retail channels and its crucial-branded products through a Web-based customer direct sales channel, as well as through channel and distribution partners.

The Company competes with Intel, Samsung Electronics Co., Ltd., SanDisk Corporation, SK Hynix Inc. and Toshiba Corporation.

Company Address

Micron Technology Inc

8000 S Federal Way,
PO Box 6
BOISE   ID   83716-9632
P: +1208.3684000
F: +1208.3684435

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