Profile: Rudolph Technologies Inc (RTEC.N)
17 May 2019
Rudolph Technologies, Inc. (Rudolph), incorporated on June 13, 1996, is engaged in the design, development, manufacture and support of process control defect inspection and metrology, advanced packaging lithography, and data analysis systems and software used by microelectronics device manufacturers. The Company provides process and yield management solutions used in both wafer processing and final manufacturing through a family of standalone systems for macro-defect inspection, lithography, probe card test and analysis, and transparent and opaque thin film measurements. The Company offers Process Control Business, Lithography Business and Integrated Software Solutions. Rudolph markets and sells products to logic, memory, data storage, flat panel, application-specific integrated circuit (ASIC) device and packaging manufacturers. Its products include AMX 6000 Series, Explorer Inspection Platform, MetaPULSE System, Wafer Scanner Inspection System, GateWay Software, Yield Optimizer Software, Firefly Inspection Series, PrecisionWoRx System, ControlWORKS Software, Process Sentinel Software, Genesis Software and RecipeWORKS Software. The Company's manufacturing activities are conducted in its manufacturing facilities in Bloomington, Minnesota and Wilmington, Massachusetts.
Process Control Business
The Company's Process Control Business includes macro defect inspection, all-surface inspection, residue detection, automated defect classification and pattern analysis, yield analysis, probe card test and analysis, optical acoustic metrology, opaque film metrology, ellipsometry, reflectometry and transparent film metrology. Field-established tools, such as the F30 and NSX inspection systems are found in wafer processing (front-end) and final manufacturing (back-end) facilities around the world. In addition, to wafer frontside inspection, Rudolph's Explorer Platform allows wafer edge and backside inspection in one integrated platform. Using Discover yield management software, the amounts of data gathered through automated inspection can be analyzed and classified to determine trends that affect yield. All-surface refers to inspection of the wafer frontside, edge, and backside, as well as post-fab die. Rudolph's Clearfind technology highlights residue on bumps and bond pads or at the bottoms of vias. Its systems capture full-color whole wafer images using simultaneous dark and bright field illumination. Defect data analysis is performed to identify, analyze and locate the source of defects and other manufacturing process excursions. Using either a single wafer map or a composite map created from multiple wafer maps, this analysis enables identification of defect patterns and distribution.
The Company has designed a combination of Fast three-dimensional optical comparative metrology (3D-OCM) Technology with testing accuracy and repeatability. The three-dimensional (3D) solutions enable users to analyze probe marks and probe tips. Optical acoustic metrology involves the use of ultra-fast laser induced sonar for metal and opaque thin film measurement. Its non-contact, non-destructive optical acoustic technology and small spot size enable its PULSE Technology systems to measure film properties directly on product wafers. The MetaPULSE System gives customers the ability to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers without contacting in a non-destructive manner on product wafers. Ellipsometry is a non-contact, non-destructive optical technique for transparent thin film measurement. For applications requiring spectral coverage, some of its ellipsometry tools are also equipped with a reflectometer. Rudolph's transparent film technology uses up to four lasers operating simultaneously at multiple angles and multiple wavelengths, providing powerful analysis and measurement solutions.
The Company's Lithography Business includes step and repeat technology; advanced packaging lithography systems, and flat panel display (FPD) lithography. Rudolph steppers use projection optics to expose circuit patterns from a mask or reticle onto a substrate to achieve images with optimal fidelity. These systems employ light from a mercury arc lamp that is transmitted through a mask or reticle containing display circuit patterns. The JetStep W Series is designed for wafers and other round substrates while the JetStep S Series is designed for rectangular substrates (panels). Both systems boast a printable field, which when combined with user-selectable wavelength options, maximizes throughput while not limiting resolution when needed. Rudolph's JetStep G Series uses high-fidelity optics and the printable stepper field available enabling more displays per shot. This feature, combined with on-the-fly auto-focus and magnification compensation, maximizes throughput and yield.
Integrated Software Solutions
The Company's Integrated Software Solutions include process control software and yield management software (YMS). It provides a range of process control solutions, including run-to-run control, fault detection, classification and tool automation. Advanced process control (APC) employs software to automatically detect or predict tool failure (fault detection), as well as calculate recipe settings for a process. Semiconductor manufacturers use YMS to obtain process yield and equipment productivity information. The data necessary to generate productivity information comes from various different sources throughout the fab: inspection and metrology systems, tool sensors, tool recipes, electrical tests and the fab environment. Rudolph's YMS are designed to analyze data from disparate sources and multiple sites across the entire value chain.
The Company competes with KLA-Tencor, Camtek, Ltd., Ultratech, Inc., Nanometrics, Incorporated, Nova Measuring Instruments and Nikon.
Rudolph Technologies Inc
16 Jonspin Rd
WILMINGTON MA 01887-1093